Sangho Lee Research Group
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Research Areas
Mix-and-Match of Single-Crystal
Freestanding Electronic Components
Our research is dedicated to advancing materials, processes, and device technologies that open new frontiers in next-generation electronics through wafer-free monolithic 3D (M3D) integration of high-quality electronic components. To realize this vision, we develop innovative strategies for stacking, integrating, and assembling diverse electronic materials and devices across different functionalities, dimensionalities, and length scales, pushing the boundaries of conventional semiconductor technologies.
Our research focuses on three complementary research directions that address longstanding challenges in micro- and nanoelectronics beyond the capabilities of conventional materials, processes, and device architectures:
Together, these research directions aim to establish versatile, scalable integration platforms for next-generation high-performance, high-density, and multifunctional electronic systems.
Seamless Integration of Mixed-Dimensional
Electronic Systems
